翻訳と辞書 Words near each other ・ Alexander Conze ・ Alexander Cooke ・ Alexander Cools ・ Alexander Cooper ・ Alexander Coosemans ・ Alexander Corbett ・ Alexander Cordell ・ Alexander Cores ・ Alexander Cornell du Houx ・ Alexander Correctional Institution ・ Alexander Corro ・ Alexander Corryn ・ Alexander Cory ・ Alexander Cosby ・ Alexander Cosby Jackson ・ Alexander Coucoulas ・ Alexander County ・ Alexander County Schools ・ Alexander County, Illinois ・ Alexander County, North Carolina ・ Alexander Courage ・ Alexander Coutanche, Baron Coutanche ・ Alexander Coutts ・ Alexander Cowan ・ Alexander Cowie ・ Alexander Cozens ・ Alexander Craig ・ Alexander Craig Sellar ・ Alexander Craighead ・ Alexander Crawford Dictionary Lists mini英和辞書 mini和英辞書 Webster 1913 Latin-English FOLDOC Wikipedia English ウィキペディア

翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Alexander Coucoulas ： ウィキペディア英語版 Alexander Coucoulas ==Father Of Thermosonic Bonding== Alexander Coucoulas is an American inventor, research engineer, and author. He was named "Father Of Thermosonic Bonding" by George Harman,〔Harman, G., Wire Bonding In Microelectronics], McGraw-Hill, Chapt. 2, pg.36, also search Coucoulas at http://www.amazon.com/WIRE-BONDING-MICROELECTRONICS-3-E/dp/0071476237/ref=sr_1_1?s=books&ie=UTF8&qid=1354948679&sr=1-1&keywords=wire+bonding+in+microelectronics#_ search Coucoulas〕〔Thermosonic bonding〕 the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, ''Wire Bonding In Microelectronics.〔Coucoulas, A., Trans. Metallurgical Society Of AIME, “Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films”, 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondalta〕〔Coucoulas, A., “Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes”, Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding〕 Thermosonic bonding is widely used to electrically connect silicon integrated circuit microprocessor chips〔〔T.R. Reid, "The Chip: How Two Americans Invented the Microchip and Launched a Revolution"〕 into computers as well as a myriad of other electronic devices that require wire bonding. As a result of Coucoulas introducing the thermosonic wire bonding concept in the early 1960s, its applications and scientific investigations by researchers throughout the world have grown as confirmed by the thousands of Google search-sites. The all-important proven reliability of thermosonic bonding, as confirmed by these investigations, has made it the process of choice for connecting these crucially important electronic components. And since relatively low bonding parameters were shown to form reliable thermosonic bonds, the integrity of the fragile silicon integrated circuit chip central processor unit or CPU, is assured throughout its intended lifetime use as the "brains" of the computer. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Alexander Coucoulas」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.